公开(公告)号：US20190059160A1

公开(公告)日：2019-02-21

申请号：US16078887

申请日：2017-02-27

Applicant: Thin Film Electronics ASA

Inventor： Olle HAGEL

IPC: H05K3/32 ,  C09J9/02 ,  C09J5/06 ,  H05K3/30 ,  H01L23/00 ,  H05K1/03 ,  H05K1/18

Abstract: A method of and system for manufacturing an electronic device, a curable conductive adhesive for use in the same, and an electronic device are disclosed. The method includes printing a conductive adhesive onto pads at ends of traces on a substrate, placing one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and after the component(s) have been placed onto the pads, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength (band). The system comprises a printer configured to print a conductive adhesive onto pads at ends of traces on a substrate, a surface mounting machine configured to place one or more components having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and a curing station configured to cure the conductive adhesive after the component(s) have been placed onto the pads.