Methods and systems for providing preferred stock credit default swaps
    1.
    发明申请
    Methods and systems for providing preferred stock credit default swaps 失效
    提供优先股票信用违约互换的方法和系统

    公开(公告)号:US20070083447A1

    公开(公告)日:2007-04-12

    申请号:US11519577

    申请日:2006-09-11

    IPC分类号: G06Q40/00

    CPC分类号: G06Q40/02 G06Q40/00

    摘要: In one aspect, the invention comprises a method comprising the steps of: (a) specifying a reference entity which is an obligor with respect to preferred securities; (b) defining a credit event to include deferral of dividend or coupon on the preferred securities; (c) specifying a payoff to include the preferred securities, the payoff to be made following the credit event; (d) specifying a premium; (e) executing an agreement with a protection buyer, wherein the agreement comprises terms based on the reference entity, the credit event, and the payoff, and wherein the protection buyer agrees to pay the premium in return for a promise to provide the payoff to the protection buyer upon occurrence of the credit event; and (f) receiving the premium from the protection buyer.

    摘要翻译: 一方面,本发明包括一种方法,该方法包括以下步骤:(a)指定作为优先证券的承付人的参照实体; (b)定义信贷事件,包括将优先证券的股息或优惠券推迟; (c)指明收益以包括首选证券,在信贷事件之后作出的回报; (d)订明保费; (e)与保护买家签订协议,其中该协议包括基于参考实体,信用事件和收益的条款,并且其中保护买方同意支付溢价以作为回报提供回报的承诺 发生信用事件时的保护买家; 和(f)从保护买家收取保费。

    Methods and systems for providing preferred stock credit default swaps
    2.
    发明授权
    Methods and systems for providing preferred stock credit default swaps 失效
    提供优先股票信用违约互换的方法和系统

    公开(公告)号:US08510203B2

    公开(公告)日:2013-08-13

    申请号:US11519577

    申请日:2006-09-11

    IPC分类号: G06Q40/00

    CPC分类号: G06Q40/02 G06Q40/00

    摘要: In one aspect, the invention comprises a method comprising the steps of: (a) specifying a reference entity which is an obligor with respect to preferred securities; (b) defining a credit event to include deferral of dividend or coupon on the preferred securities; (c) specifying a payoff to include the preferred securities, the payoff to be made following the credit event; (d) specifying a premium; (e) executing an agreement with a protection buyer, wherein the agreement comprises terms based on the reference entity, the credit event, and the payoff, and wherein the protection buyer agrees to pay the premium in return for a promise to provide the payoff to the protection buyer upon occurrence of the credit event; and (f) receiving the premium from the protection buyer.

    摘要翻译: 一方面,本发明包括一种方法,该方法包括以下步骤:(a)指定作为优先证券的债务人的参照实体; (b)定义信贷事件,包括将优先证券的股息或优惠券推迟; (c)指明收益以包括首选证券,在信贷事件之后作出的回报; (d)订明保费; (e)与保护买家签订协议,其中该协议包括基于参考实体,信用事件和收益的条款,并且其中保护买方同意支付溢价以作为回报提供回报的承诺 发生信用事件时的保护买家; 和(f)从保护买家收取保费。

    Charged Particle Beam Processing System with Visual and Infrared Imaging
    3.
    发明申请
    Charged Particle Beam Processing System with Visual and Infrared Imaging 有权
    带有视觉和红外成像的带电粒子束处理系统

    公开(公告)号:US20120006987A1

    公开(公告)日:2012-01-12

    申请号:US13179109

    申请日:2011-07-08

    IPC分类号: G01J5/10

    摘要: A charged particle beam system for processing substrates is disclosed, comprising a charged particle column, combination infrared radiation and visible light illumination and imaging subsystems, in-vacuum optics, and a precision stage for supporting and positioning the substrate alternately under the charged particle column and the imaging system. The axes of the charged particle column and imaging system are offset to enable much closer working distances for both imaging and beam processing than would be possible in a single integrated assembly. A method for extremely accurately calibrating the offset between the column and imaging system is disclosed, enabling beam processing at precisely-determined locations on the substrate. The imaging system is capable of locating sub-surface features on the substrate which cannot be seen using the charged particle beam. Two illumination modes are disclosed, enabling both bright-field and dark-field imaging in infrared radiation and visible light.

    摘要翻译: 公开了一种用于处理衬底的带电粒子束系统,包括带电粒子柱,组合红外辐射和可见光照明和成像子系统,真空内光学器件,以及精确级,用于在充电粒子柱下方交替地支撑和定位衬底, 成像系统。 带电粒子柱和成像系统的轴线偏移,以使成像和光束处理的工作距离远远大于单个集成组件中可能的距离。 公开了一种用于非常精确校准柱和成像系统之间的偏移的方法,使得能够在基板上的精确确定的位置处进行光束处理。 成像系统能够将基底上的子表面特征定位为使用带电粒子束不能看到的。 公开了两种照明模式,使得能够在红外辐射和可见光下进行亮场和暗场成像。