Housing for accommodating an electronic circuit
    1.
    发明授权
    Housing for accommodating an electronic circuit 有权
    用于容纳电子电路的外壳

    公开(公告)号:US09153971B2

    公开(公告)日:2015-10-06

    申请号:US14352234

    申请日:2011-11-30

    摘要: A housing for receiving an electronic circuit (4) having a plurality of components (5) having a carrier plate (7) and a housing cover (8) including a circumferentially enclosing wall (9) on the carrier plate (7) and a cover part (10) on the wall (9), which cover part (10) lies opposite the carrier plate (7). A volume compensation element (11) is attached on the carrier plate (7) in an interior (12) of the housing cover (8) which is enclosed in a pressure-tight manner from an external atmosphere. The volume compensation element (11) is elastically formed providing a variable volume for compensation of pressure fluctuations in the interior (12), which variable volume occurs with a change in position of the volume compensation element (11) relative to the carrier plate (7). A gap between the volume compensation element (11) and the carrier plate (7) is connected to the external atmosphere.

    摘要翻译: 一种用于接收电子电路(4)的壳体,所述电子电路(4)具有多个具有承载板(7)的部件(5)和在所述承载板(7)上包括周向包围壁(9)的壳体盖子, 所述壁(9)上的部分(10),所述盖(10)位于所述承载板(7)的对面。 体积补偿元件(11)安装在壳体盖(8)的内部(12)的承载板(7)上,外壳盖(8)的内部(12)从外部气氛以压力方式封闭。 体积补偿元件(11)被弹性地形成,提供用于补偿内部(12)中的压力波动的可变容积,该容积补偿元件(11)随着体积补偿元件(11)相对于承载板(7)的位置变化而发生 )。 体积补偿元件(11)和承载板(7)之间的间隙连接到外部气氛。