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公开(公告)号:US11380798B2
公开(公告)日:2022-07-05
申请号:US16899665
申请日:2020-06-12
申请人: Tianma Japan, Ltd.
发明人: Kazushige Takechi , Jun Tanaka , Kenji Sera , Yong Yuan
IPC分类号: H01L29/786 , H01L29/66 , H01L21/02 , H01L29/49
摘要: A thin-film device includes a polysilicon element and an oxide semiconductor element. The polysilicon element includes a first part made of low-resistive polysilicon. The oxide semiconductor element includes a second part made of low-resistive oxide semiconductor. The first part and the second part are disposed to overlap each other and connected.