公开(公告)号：US06724077B2

公开(公告)日：2004-04-20

申请号：US09986715

申请日：2001-11-09

申请人： Tim M. Gates ,  Brent S. Stone

发明人： Tim M. Gates ,  Brent S. Stone

IPC分类号： H01L2352

CPC分类号： H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket.

摘要翻译： 制造方法和半导体封装提供增强的性能。 半导体封装包括具有集成电路（IC）的半导体管芯和具有与IC连接的管芯侧的衬底。 多个多信号母线耦合到衬底的插座侧，使得母线使得能够在衬底和插座之间传输I / O信号。

公开(公告)号：US07034390B2

公开(公告)日：2006-04-25

申请号：US10670210

申请日：2003-09-26

申请人： Tim M. Gates ,  Brent S. Stone

发明人： Tim M. Gates ,  Brent S. Stone

IPC分类号： H01L23/52

CPC分类号： H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket.