SEMICONDUCTOR DEVICE
    1.
    发明申请

    公开(公告)号:US20190115430A1

    公开(公告)日:2019-04-18

    申请号:US16089421

    申请日:2017-03-30

    Abstract: Provided is a semiconductor device. A semiconductor device includes a substrate, a buffer layer provided on the substrate, a semiconductor layer provided on the buffer layer, a body region provided at a part of a surface layer of the semiconductor layer, a source region provided at a part of a surface layer of the body region, a drain region provided at a part of the surface layer of the semiconductor layer outside the body region, a gate insulating layer provided to extend from the surface layer of the body region to a predetermined depth, a gate electrode provided on the gate insulating layer, a source electrode provided on the source region, a drain electrode provided on the drain region, and an isolation region provided to extend from the surface layer of the semiconductor layer to above the predetermined depth.

    Semiconductor device
    2.
    发明授权

    公开(公告)号:US11152468B2

    公开(公告)日:2021-10-19

    申请号:US16089421

    申请日:2017-03-30

    Abstract: Provided is a semiconductor device. A semiconductor device includes a substrate, a buffer layer provided on the substrate, a semiconductor layer provided on the buffer layer, a body region provided at a part of a surface layer of the semiconductor layer, a source region provided at a part of a surface layer of the body region, a drain region provided at a part of the surface layer of the semiconductor layer outside the body region, a gate insulating layer provided to extend from the surface layer of the body region to a predetermined depth, a gate electrode provided on the gate insulating layer, a source electrode provided on the source region, a drain electrode provided on the drain region, and an isolation region provided to extend from the surface layer of the semiconductor layer to above the predetermined depth.

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