公开(公告)号：US20240112936A1

公开(公告)日：2024-04-04

申请号：US18472157

申请日：2023-09-21

Applicant: Tokyo Electron Limited

Inventor： Mitsuyori SUWA ,  Takehiro SHINDO ,  Akio TATEISHI

IPC: H01L21/677

CPC classification number: H01L21/67709 ,  H01L21/67712 ,  H01L21/67742 ,  H01L21/67745

Abstract: A substrate transfer module includes: a transfer space in which a transport body including a magnet moves in a lateral direction while being levitated from a floor by magnetic force to transfer a substrate; a hole forming member having a through-hole formed in a vertical direction; a partition member that forms the floor by overlapping a hole edge portion of the through-hole in the vertical direction to block the through-hole, and defines the transfer space having an atmosphere that is separated from a non-transfer space including a portion under the floor outside the transfer space; and a plurality of electromagnets provided in the non-transfer space at positions overlapping the through-hole to move the transport body in the lateral direction, wherein each of the electromagnets is individually fed with power from a power feeder provided in the non-transfer space via a power feed line.