Substrate defect inspection method, storage medium, and substrate defect inspection apparatus

    公开(公告)号:US11669955B2

    公开(公告)日:2023-06-06

    申请号:US17252151

    申请日:2019-06-10

    CPC classification number: G06T7/001 G03F7/162 G06T7/0008 G06T2207/30148

    Abstract: Defects of substrates are inspected when executing a job in which a treatment recipe for substrates and the substrates being treatment objects are designated to perform predetermined treatments on the substrates. An imaging step successively images substrates. A first determination step decomposes, in order from the substrate as head of the job, a planar distribution of pixel values in a substrate image captured at the imaging step into pixel value distribution components using a Zernike polynomial, calculates Zernike coefficients of the pixel value distribution components corresponding to defects to be detected, and determines presence or absence of a defect based on the calculated Zernike coefficients. A second determination step determines, from predetermined timing after one or more substrates is determined to have no defect at the first determination step, presence or absence of a defect based on the substrate image determined to have no defect at the first determination step.

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