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公开(公告)号:US20060072292A1
公开(公告)日:2006-04-06
申请号:US11241917
申请日:2005-10-04
申请人: Tomohide Ogura , Junichi Kimura , Noriharu Esaki , Tatuya Okamoto
发明人: Tomohide Ogura , Junichi Kimura , Noriharu Esaki , Tatuya Okamoto
IPC分类号: H05K7/20
CPC分类号: H05K9/0022 , H01L2924/16153
摘要: A high-frequency module attached with a shield case. Barrier 36 of the shield case has wall 37 provided by being bent from ceiling section 32; wall 38 that is opposed to wall 37 and that is provided by being bent from ceiling section 32; and linkage section 39 for linking the tip end of wall 38 to the tip end of wall 37. The shield case further has: a crossing section at which wall 37 crosses ceiling section 32 and side plate 33; notches 43 respectively provided at the crossing sections at which wall 38, ceiling section 32 and side plate 33 cross one another; and division section 44 for segmentalizing side plate 33 from notches 43 in downward direction. The boundary between circuit block 4 and circuit block 5 is provided at a position corresponding to barrier 36. Connection section 34 is connected to the ground of circuit block 4 or circuit block 5. As a result, a module having a superior shielding performance can be provided through which a signal from a circuit provided on the printed circuit board can be prevented from leaking.
摘要翻译: 附有屏蔽盒的高频模块。 屏蔽罩的屏障36具有通过从天花板部分32弯曲而提供的壁37; 壁38,其与壁37相对,并且通过从顶部32弯曲而提供; 以及用于将壁38的前端与壁37的前端连接的连杆部39。 屏蔽壳还具有:壁37穿过顶板部分32和侧板33的交叉部分; 分别设置在壁38,顶板部32和侧板33交叉的交叉部处的切口43; 以及用于将侧板33从向下方向的切口43分段的分割部44。 电路块4和电路块5之间的边界设置在对应于屏障36的位置。 连接部分34连接到电路块4或电路块5的接地。 结果,可以提供具有优良屏蔽性能的模块,通过该模块可以防止设置在印刷电路板上的电路的信号泄漏。
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公开(公告)号:US07183498B2
公开(公告)日:2007-02-27
申请号:US11241917
申请日:2005-10-04
申请人: Tomohide Ogura , Junichi Kimura , Noriharu Esaki , Tatuya Okamoto
发明人: Tomohide Ogura , Junichi Kimura , Noriharu Esaki , Tatuya Okamoto
IPC分类号: H05K9/00
CPC分类号: H05K9/0022 , H01L2924/16153
摘要: A high-frequency module has an attached shield case. Barrier 36 of the shield case has wall 37 provided by being bent from ceiling section 32; wall 38 that is opposed to wall 37 and that is provided by being bent from ceiling section 32; and linkage section 39 for linking the tip end of wall 38 to the tip end of wall 37. The shield case further has: a crossing section at which wall 37 crosses ceiling section 32 and side plate 33; notches 43 respectively provided at the crossing sections at which wall 38, ceiling section 32 and side plate 33 cross one another; and division section 44 extending downward from notches 43 for segmentalizing side plate 33. A boundary between circuit block 4 and circuit block 5 is provided at a position corresponding to barrier 36. Connection section 34 is connected to the ground of circuit block 4 or circuit block 5. As a result, a module having a superior shielding performance can be provided to prevent leakage of a signal from a circuit provided on the printed circuit board.
摘要翻译: 高频模块有一个附加的屏蔽盒。 屏蔽罩的屏障36具有通过从天花板部分32弯曲而提供的壁37; 壁38,其与壁37相对,并且通过从顶部32弯曲而提供; 以及用于将壁38的前端与壁37的前端连接的连杆部39。 屏蔽壳还具有:壁37穿过顶板部分32和侧板33的交叉部分; 分别设置在壁38,顶板部32和侧板33交叉的交叉部处的切口43; 以及从用于分段侧板33的凹口43向下延伸的分隔部分44。 电路块4和电路块5之间的边界设置在对应于屏障36的位置。 连接部分34连接到电路块4或电路块5的接地。 结果,可以提供具有优良屏蔽性能的模块以防止来自设置在印刷电路板上的电路的信号泄漏。
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公开(公告)号:US4292078A
公开(公告)日:1981-09-29
申请号:US91301
申请日:1979-11-05
申请人: Sinya Honda , Takeshi Komura , Naomi Sugita , Tatuya Okamoto
发明人: Sinya Honda , Takeshi Komura , Naomi Sugita , Tatuya Okamoto
CPC分类号: C22C32/0073 , C22C27/04 , H01H1/021
摘要: Electrical contact material of this invention consists of 10 to 20 percent by weight of nickel, 0.05 to 2 percent by weight of titanium boride and the balance tungsten. Conventionally, nickel-tungsten alloy shows poor mechanical properties (e.g. brittleness) although the alloy shows high oxidation resistance and can be produced in an inexpensive way. Inclusion of titanium boride greatly improves the mechanical properties of such alloy, thereby enabling the cheap production of electrical contact material which has sufficient practical use.
摘要翻译: 本发明的电接触材料由10〜20重量%的镍,0.05〜2重量%的硼化钛和余量的钨组成。 通常,镍 - 钨合金显示出差的机械性能(例如脆性),尽管该合金显示出高抗氧化性并且可以以便宜的方式制造。 纳入硼化钛大大提高了这种合金的机械性能,从而能够廉价地生产具有足够实际应用的电接触材料。
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