公开(公告)号：US20110266274A1

公开(公告)日：2011-11-03

申请号：US12312755

申请日：2007-11-26

申请人： Toshiki Ebata ,  Sridhar R. Prasad ,  Ajay Rao ,  Takeshi Higuchi ,  Kensuke Fujimura ,  Akira Miyahara ,  Eric Witenberter

发明人： Toshiki Ebata ,  Sridhar R. Prasad ,  Ajay Rao ,  Takeshi Higuchi ,  Kensuke Fujimura ,  Akira Miyahara ,  Eric Witenberter

IPC分类号： H05B3/68

CPC分类号： H01L21/68757 ,  H01L21/67115 ,  H05B3/14

摘要： The current invention relates to a semiconductor wafer heater assembly having a frosted clear quartz material for the wafer susceptor (6) that is placed between the heater (8) and the wafer (7) such that at certain wavelengths of the emitted radiant energy from the heater (8), the frosted clear quartz material is ‘thermally transmissive’ to the thermal radiation from the infrared region. The heater assembly is characterized in that the top quartz plate or susceptor (6) on which the wafer (7) is supported is made of a material that is not “optically transmissive” but is more than 90% “thermally transmissive” to infrared emission that is shorter than 3.5 micrometer wavelength and having higher tolerance and mechanical strength than conventional clear quartz material.

摘要翻译： 本发明涉及一种半导体晶片加热器组件，其具有用于晶片基座（6）的磨砂透明石英材料，晶片基座（6）放置在加热器（8）和晶片（7）之间，使得在某些波长的辐射能量 加热器（8），磨砂透明石英材料对来自红外区域的热辐射是“热传导的”。 加热器组件的特征在于，其上支撑晶片（7）的顶部石英板或基座（6）由不是“光学透射”但对红外发射超过90％“热传导”的材料制成 短于3.5微米波长，并且具有比常规透明石英材料更高的公差和机械强度。