METHOD FOR MAKING A METALLIC CREDIT CARD
    2.
    发明公开

    公开(公告)号:US20230252249A1

    公开(公告)日:2023-08-10

    申请号:US17979470

    申请日:2022-11-02

    申请人: Travis Jean

    发明人: Travis Jean

    IPC分类号: G06K1/12

    CPC分类号: G06K1/12

    摘要: A method of making a metallic credit card from an existing plastic credit card including the steps of cutting the existing plastic credit card from each side edge, peeling the plastic top layer from its bottom plastic substrate, removing its EMV chip, and attaching it to a metallic substrate. The metallic substrate can further be laser engraved with the user's personal information. An alternate embodiment of the method of making a metallic credit card includes the steps of placing the existing plastic credit card into a metal casing, heating the metal casing and existing plastic credit card to loosen the EMV chip from the plastic layers of the credit card, cutting an incision into the side of the credit card to access and remove the EMV chip, and then attaching the EMV chip to a metallic substrate.

    Method for making a metallic credit card

    公开(公告)号:US12045679B2

    公开(公告)日:2024-07-23

    申请号:US17979470

    申请日:2022-11-02

    申请人: Travis Jean LLC

    发明人: Travis Jean

    IPC分类号: G06K1/12

    CPC分类号: G06K1/12

    摘要: A method of making a metallic credit card from an existing plastic credit card including the steps of cutting the existing plastic credit card from each side edge, peeling the plastic top layer from its bottom plastic substrate, removing its EMV chip, and attaching it to a metallic substrate. The metallic substrate can further be laser engraved with the user's personal information. An alternate embodiment of the method of making a metallic credit card includes the steps of placing the existing plastic credit card into a metal casing, heating the metal casing and existing plastic credit card to loosen the EMV chip from the plastic layers of the credit card, cutting an incision into the side of the credit card to access and remove the EMV chip, and then attaching the EMV chip to a metallic substrate.