公开(公告)号：USD927581S1

公开(公告)日：2021-08-10

申请号：US29682890

申请日：2019-03-08

Applicant: TuSimple, Inc.

Designer： Zhihua Ma

公开(公告)号：US10791653B2

公开(公告)日：2020-09-29

申请号：US16242881

申请日：2019-01-08

Applicant: TuSimple

Inventor： Zhihua Ma

IPC: H05K7/20 ,  H05K7/14

Abstract: The present application describes a computer server. The computer server includes a plurality of layers of fixed plates each having at least one corresponding component provided thereon. An air inlet and an air outlet are provided on side panels of an outer shell of the server case. A first set of fans is provided on an inward-facing side of the air inlet, and a second set of fans is provided on an inward-facing side of the air outlet. The first set of fans and the second set of fans generate a high-pressure airflow from the air inlet to the air outlet. The computer server further comprises at least one first heat sink and a second heat sink, wherein the at least one first heat sink is connected to a heat generating component on the plurality of layers of fixed plates.

公开(公告)号：USD903598S1

公开(公告)日：2020-12-01

申请号：US29617659

申请日：2017-09-15

Applicant: TuSimple, Inc.

Designer： Zhihua Ma

公开(公告)号：US20190289752A1

公开(公告)日：2019-09-19

申请号：US16242845

申请日：2019-01-08

Applicant: TuSimple

Inventor： Zhihua Ma

IPC: H05K7/20

Abstract: The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

公开(公告)号：US10973152B2

公开(公告)日：2021-04-06

申请号：US16242845

申请日：2019-01-08

Applicant: TuSimple, Inc.

Inventor： Zhihua Ma

IPC: H05K7/20

Abstract: The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

公开(公告)号：USD929487S1

公开(公告)日：2021-08-31

申请号：US29617661

申请日：2017-09-15

Applicant: TUSIMPLE, INC.

Designer： Zhihua Ma

公开(公告)号：USD918839S1

公开(公告)日：2021-05-11

申请号：US29691751

申请日：2019-05-19

Applicant: TuSimple, Inc.

Designer： Zhihua Ma

公开(公告)号：US20190254196A1

公开(公告)日：2019-08-15

申请号：US16242881

申请日：2019-01-08

Applicant: TuSimple

Inventor： Zhihua Ma

IPC: H05K7/20 ,  H05K7/14

Abstract: The present disclosure provides a computer server. The computer server includes, in an internal space of a case, a plurality of layers of fixed plates arranged in a vertical direction from a bottom of the case to a top of the case. Each of the plurality of layers of fixed plates has at least one corresponding component provided thereon. An air inlet is provided on a first side panel of an outer shell of the case, and an air outlet is provided a second side panel of the outer shell of the case, the first side panel and the second side panel being opposite to each other. A first set of fans is provided on an inward-facing side of the air inlet, and a second set of fans is provided on an inward-facing side of the air outlet. The first set of fans and the second set of fans generate a high-pressure airflow from the air inlet to the air outlet. The component on each of the plurality of layers of fixed plates is cooled by the high-pressure airflow.