公开(公告)号：US11602654B2

公开(公告)日：2023-03-14

申请号：US17038569

申请日：2020-09-30

Applicant: Tyco Fire Products LP

Inventor： Michael J. VerBrugge ,  Manuel R. Silva, Jr. ,  Brian J. Kramer

IPC: A62C37/12

Abstract: A fusible link assembly including a first detection line, a second detection line, and a fusible link. The fusible link includes, a first substrate with a first end coupled to the first detection line, a second substrate with a first end coupled to the second detection line, and a solder layer directly bonded to a second end of the first substrate and a second end of the second substrate. The solder layer is configured to prevent separation of the first substrate and the second substrate until the solder layer reaches a temperature between 500° F.-575° F.

公开(公告)号：US20210093908A1

公开(公告)日：2021-04-01

申请号：US17038569

申请日：2020-09-30

Applicant: Tyco Fire Products LP

Inventor： Michael J. VerBrugge ,  Manuel R. Silva, JR. ,  Brian J. Kramer

IPC: A62C37/12

Abstract: A fusible link assembly including a first detection line, a second detection line, and a fusible link. The fusible link includes, a first substrate with a first end coupled to the first detection line, a second substrate with a first end coupled to the second detection line, and a solder layer directly bonded to a second end of the first substrate and a second end of the second substrate. The solder layer is configured to prevent separation of the first substrate and the second substrate until the solder layer reaches a temperature between 500° F.-575° F.

公开(公告)号：US20230149757A1

公开(公告)日：2023-05-18

申请号：US18150612

申请日：2023-01-05

Applicant: Tyco Fire Products LP

Inventor： Michael J. VerBrugge ,  Manuel R. Silva, JR. ,  Brian J. Kramer

IPC: A62C37/12

CPC classification number: A62C37/12

Abstract: A fusible link assembly including a first detection line, a second detection line, and a fusible link. The fusible link includes, a first substrate with a first end coupled to the first detection line, a second substrate with a first end coupled to the second detection line, and a solder layer directly bonded to a second end of the first substrate and a second end of the second substrate. The solder layer is configured to prevent separation of the first substrate and the second substrate until the solder layer reaches a temperature between 500° F.-575° F.