Chassis spring finger tortuous path with improved manufacturability
    3.
    发明授权
    Chassis spring finger tortuous path with improved manufacturability 有权
    底盘弹簧手指弯曲路径,具有改进的可制造性

    公开(公告)号:US07132609B2

    公开(公告)日:2006-11-07

    申请号:US10607744

    申请日:2003-06-27

    IPC分类号: H01R4/48 H05K9/00

    摘要: a chassis assembly that reduces the amount of electromagnetic radiation entering or leaving the interior of the chassis assembly. The chassis assembly includes a chassis cover and chassis back. The chassis cover includes a plurality of dimpled spring contacts and hemmed edges and hemmed lips. The chassis back includes a chassis back top portion adapted to mate with the chassis cover, such that the chassis back top portion is in good contact with the one or more dimpled spring contacts, providing good electrical conductivity. Further, the chassis assembly is designed such that the mating between the chassis cover and chassis back provides a tortuous path to any electromagnetic radiation disposed to enter or leave the chassis assembly.

    摘要翻译: 底盘组件,其减少进入或离开底盘组件内部的电磁辐射的量。 底盘组件包括底盘盖和底盘背面。 底盘盖包括多个凹陷的弹簧触点和卷边和卷边。 底盘背部包括适于与底盘盖匹配的底盘后部顶部,使得底盘后顶部与一个或多个凹陷的弹簧触点良好接触,提供良好的导电性。 此外,底盘组件被设计成使得底盘盖和底盘背面之间的配合提供了设置成进入或离开底盘组件的任何电磁辐射的曲折路径。

    Method of manufacturing a chassis assembly to reduce electromagnetic interference
    4.
    发明授权
    Method of manufacturing a chassis assembly to reduce electromagnetic interference 有权
    制造底盘组件以减少电磁干扰的方法

    公开(公告)号:US07581303B2

    公开(公告)日:2009-09-01

    申请号:US11528229

    申请日:2006-09-27

    IPC分类号: B23P17/04

    摘要: A method of manufacturing a chassis assembly to reduce electromagnetic interference is disclosed. The method includes forming a chassis having a chassis cover top portion, a chassis cover step portion, a chassis cover pre-step portion, a hemmed edge, a hemmed lip, and one or more dimpled spring fingers, by forming a first bend at the hemmed edge residing between the hemmed lip and the chassis cover pre-step portion, forming a second bend between the chassis cover step portion and the chassis cover pre-step portion, and forming a third bend between the chassis cover top portion and the chassis cover step portion. The method further including forming a fourth bends between a chassis back top portion and a chassis back. The formed chassis cover is then seated with the chassis back to create a tortuous path.

    摘要翻译: 公开了一种制造底盘组件以减少电磁干扰的方法。 该方法包括通过在第一弯头处形成具有底盘盖顶部,底盘盖台阶部分,底盘盖前置部分,边缘边缘,卷边唇和一个或多个凹陷弹簧指的底盘 在边缘边缘和底盘盖前置部分之间形成边缘边缘,在底盘盖台阶部分和底盘盖前置部分之间形成第二弯曲部,并且在底盘盖顶部和底盘盖之间形成第三弯曲部 步骤部分。 所述方法还包括在底盘后顶部和底盘背部之间形成第四弯曲部。 然后将形成的底盘盖与底盘相配合,以产生曲折的路径。

    Chassis spring finger tortuous path with improved manufacturability
    5.
    发明申请
    Chassis spring finger tortuous path with improved manufacturability 有权
    底盘弹簧手指弯曲路径,具有改进的可制造性

    公开(公告)号:US20070019368A1

    公开(公告)日:2007-01-25

    申请号:US11528229

    申请日:2006-09-27

    IPC分类号: H02B1/00

    摘要: Disclosed is a chassis assembly that reduces the amount of electromagnetic radiation entering or leaving the interior of the chassis assembly. The chassis assembly comprises a chassis cover and chassis back. The chassis cover comprises a plurality of dimpled spring contacts and hemmed edges and hemmed lips. The chassis back comprises a chassis back top portion adapted to mate with the chassis cover, such that the chassis back top portion is in good contact with the one or more dimpled spring contacts, providing good electrical conductivity. Further, the chassis assembly is designed such that the mating between the chassis cover and chassis back provides a tortuous path to any electromagnetic radiation disposed to enter or leave the chassis assembly.

    摘要翻译: 公开了一种底盘组件,其减少进入或离开底盘组件内部的电磁辐射的量。 底盘组件包括底盘盖和底盘背面。 底盘盖包括多个凹陷的弹簧触点和卷边和卷边。 底盘背部包括适于与底盘盖匹配的底盘后顶部,使得底盘后顶部与一个或多个凹陷的弹簧触点良好地接触,从而提供良好的导电性。 此外,底盘组件被设计成使得底盘盖和底盘背面之间的配合提供了设置成进入或离开底盘组件的任何电磁辐射的曲折路径。