公开(公告)号：US20190217592A1

公开(公告)日：2019-07-18

申请号：US15872011

申请日：2018-01-16

Applicant: U.S. Department of Energy

Inventor： Kamleshkumar Suthar ,  Marion M. White

IPC: B32B37/10 ,  B32B37/08 ,  B32B1/00 ,  B32B37/06

CPC classification number: B32B37/10 ,  B32B1/00 ,  B32B37/06 ,  B32B37/08

Abstract: A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.