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公开(公告)号：US11510320B2
公开(公告)日：2022-11-22
申请号：US16313847
申请日：2017-11-30
Applicant: ULVAC, INC.
Inventor： Muneyuki Sato , Yasuhiro Morikawa , Minoru Suzuki
Abstract: A method of the invention is a method of processing a wiring substrate that includes a configuration in which conductors locally disposed on a substrate are coated with resin having inorganic members that form a filler and are dispersed in an organic member, the method including: removing the organic member from a surface layer side of the resin by use of an ashing method; and removing, by use of a wet cleaning method, the inorganic members remaining the surface layer side of the resin from which the organic member is removed.
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