公开(公告)号：US20150325839A1

公开(公告)日：2015-11-12

申请号：US14652947

申请日：2013-12-17

Applicant: UMICORE

Inventor： Stijn PUT ,  Kris DRIESEN ,  Jean-Sebastien BRIDEL ,  Hailei ZHAO ,  Jing WANG

IPC: H01M4/134 ,  H01M4/38 ,  H01M4/587 ,  H01M4/36 ,  H01M4/133

CPC classification number: H01M4/134 ,  H01M4/133 ,  H01M4/364 ,  H01M4/366 ,  H01M4/386 ,  H01M4/485 ,  H01M4/587 ,  H01M4/62 ,  H01M4/625 ,  H01M10/052

Abstract: The invention relates to An active material for a rechargeable lithium ion battery, comprising metal (M) based particles and a silicon oxide SiOx with 0

Abstract translation: 本发明涉及一种用于可再充电锂离子电池的活性材料，其包含基于金属（M）的颗粒和具有0

公开(公告)号：US20240328023A1

公开(公告)日：2024-10-03

申请号：US18737789

申请日：2024-06-07

Applicant: SUZHOU SHINHAO MATERIALS LLC ,  UMICORE GALVANOTECHIK GMBH

Inventor： Yun ZHANG ,  Xingxing ZHANG ,  Volker WOHLFARTH ,  Jing WANG ,  Peipei DONG ,  Wei ZHAO

IPC: C25D3/38 ,  C25D17/00 ,  H05K3/24

CPC classification number: C25D3/38 ,  C25D17/001 ,  H05K3/241

Abstract: A method of electroplating a stress-free copper film on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; heating the electroplating bath to 25 to 60° C.; and electroplating the substrate in the electroplating bath to form the stress-free copper film while maintaining the electroplating bath at 25 to 60° C. The leveler is an organic compound containing an amine group. The method further includes annealing the stress-free copper film at 60-260° C. for 0.5 to 2 hours, or at 60-120° C. for 0.5 to 2 hours. A stress-free electroplated copper film is also disclosed.

公开(公告)号：US20220064813A1

公开(公告)日：2022-03-03

申请号：US17166104

申请日：2021-02-03

Applicant: SUZHOU SHINHAO MATERIALS LLC ,  UMICORE GALVANOTECHIK GMBH

Inventor： Yun ZHANG ,  Xingxing ZHANG ,  Volker WOHLFARTH ,  Jing WANG ,  Peipei DONG ,  Wei ZHAO

IPC: C25D3/38 ,  C25D17/00 ,  H05K3/24

Abstract: A method of electroplating a stress-free copper film on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; heating the electroplating bath to 25 to 60° C.; and electroplating the substrate in the electroplating bath to form the stress-free copper film while maintaining the electroplating bath at 25 to 60° C. The leveler is an organic compound containing an amine group. The method further includes annealing the stress-free copper film at 60-260° C. for 0.5 to 2 hours, or at 60-120° C. for 0.5 to 2 hours. A stress-free electroplated copper film is also disclosed.

公开(公告)号：US20150340687A1

公开(公告)日：2015-11-26

申请号：US14652950

申请日：2013-12-17

Applicant: UMICORE

Inventor： Stijn PUT ,  Jean-Sebastien BRIDEL ,  Hailei ZHAO ,  Jing WANG

IPC: H01M4/36 ,  H01M10/0525

CPC classification number: H01M4/364 ,  H01M4/386 ,  H01M4/485 ,  H01M4/587 ,  H01M4/624 ,  H01M10/052 ,  H01M10/0525 ,  H01M2004/027 ,  Y02E60/122

Abstract: The invention relates to a negative electrode powder for a lithium-ion rechargeable battery comprising a mixture comprising carbon and SiOx, with 0

Abstract translation: 本发明涉及一种用于锂离子可再充电电池的负极粉末，其包含含有碳和SiO x的混合物，其中0