公开(公告)号：US20220217841A1

公开(公告)日：2022-07-07

申请号：US17185216

申请日：2021-02-25

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chun Hung KUO ,  Kuo Ching CHEN

IPC: H05K1/02 ,  H05K3/20

Abstract: A circuit board is manufactured by mounting a first circuit layer, mounting a conductive bump on the first circuit layer, covering the first circuit layer with a first dielectric layer which exposes the conductive bump, mounting a second dielectric layer on the first dielectric layer with a second dielectric layer opening that exposes the conductive bump, and finally, mounting a second circuit layer on the surface of the second dielectric layer and in the second dielectric layer opening. Since the surface roughness of the second dielectric layer and the second dielectric layer opening is low, it is unlikely to form nano voids between the second dielectric layer and the second circuit layer, and the second circuit layer may be attached to the second dielectric layer firmly, which is an advantage for fine line circuit disposal.