公开(公告)号：US20170164468A1

公开(公告)日：2017-06-08

申请号：US14997583

申请日：2016-01-18

申请人： UNIMICRON TECHNOLOGY CORP.

发明人： HUNG-LIN CHANG ,  MING-HAO WU ,  SYUN-SIAO CHANG ,  CHENG-PO YU ,  CHI-MIN CHANG

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K1/11

CPC分类号： H05K3/4697 ,  H05K3/4644

摘要： A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.