-
公开(公告)号：US20220165684A1
公开(公告)日：2022-05-26
申请号：US17148624
申请日：2021-01-14
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Meng-Ting CHIANG , Jen-Hsien CHANG , Kai-Kuang HO
IPC: H01L23/00 , H01L29/06 , H01L21/3065 , H01L21/78
Abstract: A semiconductor device includes a semiconductor substrate, a circuit structure and a ring-shaped protrusion. The semiconductor substrate has a front surface and a rear surface opposed to each other. The circuit structure is located on the front surface. The ring-shaped protrusion is protruded on the rear surface.
Search Results
1
records
(took 0.01 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
