SCALABLE TWO-PHASE COOLING PLATES
    1.
    发明公开

    公开(公告)号:US20230403822A1

    公开(公告)日:2023-12-14

    申请号:US17980976

    申请日:2022-11-04

    CPC classification number: H05K7/20327

    Abstract: In the past, several microchannel configurations were developed to realize two-phase cooling for high-power electronics, but these were limited to small devices with sizes at ˜cm length. It has been a challenge to implement effective two-phase cooling to large devices with a length of ˜10 cm due to notorious scaling effects. Here, we devised a novel channel configuration to achieve effective two-phase cooling on devices with an area of ˜10 cm by ˜5 cm or larger, which is the prevailing size of major commercial electronics and power electronics devices. In a lab environment, we demonstrated that the novel channel configuration can meet their cooling needs.

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