公开(公告)号：US20230085417A1

公开(公告)日：2023-03-16

申请号：US17795027

申请日：2021-02-05

申请人： UNIVERSITY OF YAMANASHI ,  NIKKI-UNIVERSAL CO., LTD.

发明人： Toshihiro MIYAO ,  Hanako NISHINO ,  Kazutoshi HIGASHIYAMA ,  Makoto UCHIDA ,  Akihiro IIYAMA ,  Kazuya SHIBANUMA ,  Naoto KOIZUMI

IPC分类号： H01M4/92 ,  H01M4/86 ,  H01M4/88

摘要： The present invention provides a supported metal catalyst with excellent effectiveness factor of active metal particles which are also free from deactivation by contacting with ionomer.
According to the present invention, provided is a supported metal catalyst, comprising a support that is a collective body of conductive particles; and dispersed active metal particles supported on the conductive particles, wherein the conductive particles include a plurality of pores, an average entrance pore diameter of the pores is 1 to 20 nm, a standard deviation of the average entrance pore diameter is equal to or less than 50% of the average entrance pore diameter, a number fraction of the active metal particles supported in a surface layer region of the conductive particles divided by the total number of the active metal particles is equal to or more than 50%, and the surface layer region is a region on a surface of the conductive particles or a region in the pores within a depth of 15 nm from the surface.

公开(公告)号：US20240266554A1

公开(公告)日：2024-08-08

申请号：US18294266

申请日：2022-08-04

申请人： UNIVERSITY OF YAMANASHI ,  Nikki-Universal Co., Ltd.

发明人： Toshihiro MIYAO ,  Hanako NISHINO ,  Makoto UCHIDA ,  Akihiro IIYAMA ,  Naoto KOIZUMI ,  Kazuya SHIBANUMA ,  Naoki TONE

IPC分类号： H01M4/92 ,  C01B32/05 ,  H01M4/86

CPC分类号： H01M4/926 ,  C01B32/05 ,  C01P2006/16 ,  C01P2006/40 ,  H01M2004/8689

摘要： A supported metal catalyst, including: a support that is a collective body of conductive particles; and dispersed active metal particles supported on the conductive particles. The conductive particles include a plurality of pores; an average entrance pore diameter of the pores is 1 to 20 nm; a standard deviation of the average entrance pore diameter is equal to or less than 50% of the average entrance pore diameter; a number fraction of the active metal particles supported in a surface layer region of the conductive particles divided by a total number of the active metal particles is equal to or more than 50%; the surface layer region is a region on a surface of the conductive particles or a region in the pores within a depth of 15 nm from the surface; and an average interparticle distance of the active metal particles is 5 to 20 nm.