公开(公告)号：US20220028762A1

公开(公告)日：2022-01-27

申请号：US17495788

申请日：2021-10-06

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Tanawan CHAOWASAKOO ,  Hua Hong TAN ,  Alexander Lucero LAYLO ,  Thanawat JAENGKRAJARNG

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/00 ,  H01L25/07 ,  H01L25/065

Abstract: An embodiment related to a device. The device includes a first die with first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad. The device also includes a first clip bond including a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion. The first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface. The device further includes a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die. The first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad, and the spacers maintain a uniform Bond Line Thickness (BLT) of the first conductive clip-die bonding layer.