公开(公告)号：US10566369B2

公开(公告)日：2020-02-18

申请号：US15839884

申请日：2017-12-13

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Tim Thian Hwee Tan ,  Boon Pek Liew ,  Chee Kay Chow ,  Teddy Joaquin Carreon

IPC: H01L27/146 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package and a method for forming a semiconductor package are disclosed. The semiconductor package includes a multi-layer package substrate having interconnect structures embedded therein. A sensor chip having an image sensing element is disposed on a top surface of the package substrate, and an integrated circuit is mounted to a bottom surface of the package substrate. The integrated circuit is a flip-chip assembly. The sensor chip is electrically connected to the integrated circuit. An adhesive material bonds a transparent covering member to the sensor chip to enclose the image sensing element.