公开(公告)号：US20240421169A1

公开(公告)日：2024-12-19

申请号：US18820297

申请日：2024-08-30

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey PUNZALAN ,  IL Kwon SHIM

IPC: H01L27/146

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die region with a die attached thereto. An encapsulant is disposed to cover encapsulation region of the package substrate. A protective cover is disposed over the die and attached to the encapsulant by a cover adhesive. The protective cover is supported by a lower portion of step shaped inner encapsulant sidewalls.

公开(公告)号：US20250079261A1

公开(公告)日：2025-03-06

申请号：US18818632

申请日：2024-08-29

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： IL Kwon SHIM ,  Roel Adeva ROBLES

IPC: H01L23/433 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065

Abstract: The present disclosure is directed to improving heat dissipation to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. The package includes at least primary and secondary heat dissipators to improve heat dissipation. In some embodiments, the package includes a tertiary heat dissipator to further improve heat dissipation.

公开(公告)号：US20250089388A1

公开(公告)日：2025-03-13

申请号：US18954423

申请日：2024-11-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Roel ROBLES ,  Kin Ming LEUNG ,  IL Kwon SHIM

IPC: H01L27/146

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die region with a die attached thereto. An encapsulant is disposed to cover the encapsulation region of the package substrate. A protective cover is disposed over the die and attached to the encapsulant. The cover is attached to the encapsulant using a mold material.

公开(公告)号：US20210399035A1

公开(公告)日：2021-12-23

申请号：US17352348

申请日：2021-06-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey PUNZALAN ,  IL Kwon SHIM

IPC: H01L27/146

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die region with a die attached thereto. An encapsulant is disposed to cover encapsulation region of the package substrate. A protective cover is disposed over the die and attached to the encapsulant by a cover adhesive. The protective cover is supported by a lower portion of step shaped inner encapsulant sidewalls.