公开(公告)号：US20210202339A1

公开(公告)日：2021-07-01

申请号：US17138741

申请日：2020-12-30

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Surachai Uraisakul ,  Siriwanna Ounkaew ,  Panumard Thammavet ,  Tanawan Chaowasakoo

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: The present disclosure is directed to improving package adhesion to provide more reliable semiconductor packages. The semiconductor package may be, for example, a leadframe including one or multiple dies attached thereto. The semiconductor package may include only clip bonds or only wire bonds or a combination of clip bonds and wire bonds. An adhesion enhancement coating may be disposed in between the package substrate and the encapsulant to improve package adhesion. For example, the adhesion enhancement coating enhances the sealing by bonding respectively with the inorganic materials of the package substrate and the organic materials of the encapsulant.