HOLE CUTTER FOR THERMOFORMING PACKAGING MACHINE AND METHOD OF USE

    公开(公告)号:US20210214111A1

    公开(公告)日:2021-07-15

    申请号:US15931212

    申请日:2020-05-13

    申请人: UltraSource LLC

    IPC分类号: B65B61/16 B65B9/02

    摘要: An apparatus is provided for cutting holes and slicing through a web of formed, filled and sealed product packages in a thermoforming packaging machine. The apparatus uses a single actuator to move a row of film-cutting punches between extended and retracted positions for cutting holes and corresponding chads in a marginal film area of the web of thermoformed product packages and a cross cut knife to slice through the marginal film area to separate rows of the thermoformed product packages.