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公开(公告)号:US20250002369A1
公开(公告)日:2025-01-02
申请号:US18703517
申请日:2022-10-20
Applicant: Umicore
Inventor: Jens Martin PAULSEN , Kris DRIESEN , Daniël NELIS , Randy DE PALMA , Kasper LAMBRIGHS , Jong-Won SHIN
Abstract: Method for preparing a precursor material for a Li-containing cathode active material for a battery, wherein the method comprises a spray pyrolysis step in which a metal oxide is produced by decomposition in a heated chamber of droplets of an aqueous solution, wherein either the metal oxide is a mixed metal oxide comprising the element Ni and one or both of the elements Co and Mn and the aqueous solution is a mixed solution of salts of Ni and of Co and/or Mn or the metal oxide is a Ni oxide and the aqueous solution is a solution of a salt of Ni, characterised in that the method comprises a spray drying step in which an aqueous slurry comprising said metal oxide is spray dried to form said precursor material.
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公开(公告)号:US20180100231A1
公开(公告)日:2018-04-12
申请号:US15558364
申请日:2016-03-17
Applicant: UMICORE
Inventor: Jong-Won SHIN
Abstract: A process for the formation of an LiM02 (e.g., LiCoO2) sputtering target with a bi-modal grain size distribution (as in a hollow cylinder target body) that includes a CIP-based process involving, for example, forming or sourcing an LiMO2 (e.g., Li—CoO2) powder; dispersion and milling (e.g., wet milling); binder introduction; drying (e.g., spray drying) to form a granulate; CIP processing of the granulate into a molded shape; and a heating cycle for debinding and sintering to form a densified sintered shape. The target body produced is suited for inclusion on a sputtering target assembly (as in a rotary sputtering target assembly with a plurality of cylindrical target bodies attached to a backing support). The invention is inclusive of the resultant target bodies formed under the CIP based process as well as an induction heater based process for attachment (e.g., metal solder bonding) of the low conductivity target body(ies) of LiMO2 (e.g., LiCoO2) to a common backing support through use of an added conductive wrap or layer provided to the target body and heated with the induction heater during the attachment process.
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公开(公告)号:US20180051371A1
公开(公告)日:2018-02-22
申请号:US15558388
申请日:2016-03-17
Applicant: UMICORE
Inventor: Jong-Won SHIN , Nikolaus MARGADANT
Abstract: A sputtering target assembly formed by relative positioning of a sputtering target body or bodies and a backing support, such that the backing support is placed within the inside diameter of the sputtering target body. The combination is heated with an induction heater surrounding the target body so that there is achieved a suitable temperature for bonding. Heating is discontinued such that there is a cooling of the bonding material and a bonding relationship established between the sputtering target body (or bodies) and the backing support. Embodiments include adding a conductive layer, as in a conductive fabric wrap, between the induction heater and internal target body(ies) that is/are inductively heated in a manner that enhances axial and radial gradient heating during bonding. The conductive wrap can be used with a low conductivity material as in an LiMO2 (e.g., Li—CoO2) target body. A non-adhesive protective wrap can also be placed about the target body such as between the conductive wrap and target body.
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