-
公开(公告)号：US11585648B2
公开(公告)日：2023-02-21
申请号：US17209839
申请日：2021-03-23
Applicant: Unimicron Technology Corporation
Inventor： Cheng-Jui Chang , Hung-Lin Chang
Abstract: An electromagnetic measuring probe device for measuring a thickness of a dielectric layer of a circuit board and a method thereof are disclosed. The circuit board has at least one dielectric layer, at least two conductive layers and a test area. The test area has a test pattern and a through hole. The electromagnetic measuring probe device has a probe-measuring unit, an external conductive element, plural magnetic powder groups, and a maintaining unit. The probe-measuring unit has a transparent tube and an internal conductive pin. The external conductive element electrically connects with the test pattern. The conductive layers and the internal conductive pin generate a magnetic field while the probe-measuring unit enters into the through hole. The magnetic powder groups magnetically attracted are gathered to positions corresponding to thickness-range positions of the conductive layers and held by the maintaining unit, thus a gap between the two dielectric layers is obtained.
-
公开(公告)号：US20220221370A1
公开(公告)日：2022-07-14
申请号：US17209954
申请日：2021-03-23
Applicant: Unimicron Technology Corporation
Inventor： Cheng-Jui Chang , Hung-Lin Chang
Abstract: A method for measuring a thickness of a dielectric layer in a circuit board is provided. The method for measuring the thickness of the dielectric layer includes the following steps. First, a circuit board including at least one dielectric layer and at least two circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes a test area including a test pattern and a through hole. The test pattern includes at least two metal layers. Next, a measuring device including a main body, at least one light source and a lens module is provided. When the main body is moved into the through hole, the light source emits light to the dielectric layer and the metal layer, and the lens module shoots the dielectric layer and the metal layer to form a captured image. The thickness of the dielectric layer is obtained via the captured image.
-
Patent Agency Ranking
公开(公告)号：US20230097273A1
公开(公告)日：2023-03-30
申请号：US17508421
申请日：2021-10-22
Applicant: Unimicron Technology Corporation
Inventor： Cheng-Jui Chang
Abstract: The method for removing partial metal wall of hole of the present invention includes the following steps. First, a circuit board is provided. The circuit board includes a plurality of circuit layers, a plurality of dielectric layers, and a plated through hole. Each of the dielectric layers is between two adjacent circuit layers. The wall of the plated through hole includes at least one residual copper. The circuit layer immediately below the residual copper is defined as a signal layer. Next, a position of the signal layer and a position of the residual copper in the plated through hole are obtained. Next, a drill is provided, the drill includes a main body and at least one needle, and the drill is moved to the position of the residual copper. The main body is rotated around the central axis of the main body, so the needle can remove part of the residual copper.
-
公开(公告)号：US20220221263A1
公开(公告)日：2022-07-14
申请号：US17209839
申请日：2021-03-23
Applicant: Unimicron Technology Corporation
Inventor： Cheng-Jui Chang , Hung-Lin Chang
Abstract: An electromagnetic measuring probe device for measuring a thickness of a dielectric layer of a circuit board and a method thereof are disclosed. The circuit board has at least one dielectric layer, at least two conductive layers and a test area. The test area has a test pattern and a through hole. The electromagnetic measuring probe device has a probe-measuring unit, an external conductive element, plural magnetic powder groups, and a maintaining unit. The probe-measuring unit has a transparent tube and an internal conductive pin. The external conductive element electrically connects with the test pattern. The conductive layers and the internal conductive pin generate a magnetic field while the probe-measuring unit enters into the through hole. The magnetic powder groups magnetically attracted are gathered to positions corresponding to thickness-range positions of the conductive layers and held by the maintaining unit, thus a gap between the two dielectric layers is obtained.
-
公开(公告)号：US20220221262A1
公开(公告)日：2022-07-14
申请号：US17209738
申请日：2021-03-23
Applicant: Unimicron Technology Corporation
Inventor： Cheng-Jui Chang , Hung-Lin Chang , Jeng-Wey Chiang
Abstract: A method for measuring thickness of dielectric layer in circuit board includes the following steps: First, circuit board including dielectric layer and circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes test area including test pattern and through hole. The test pattern includes first conductor and second conductors. The distance between the side of the through hole and the second conductor is less than the distance between the side of the through hole and the first conductor. Next, measuring device including conductive pin and sensing element is provided. Next, the conductive pin is powered, and one end of the conductive pin is electrically connected to the second conductor. Next, the sensing element is moved along the through hole to obtain sensing curve, and the thickness of the dielectric layer is calculated via variations of the sensing curve.
-
公开(公告)号：US11408799B2
公开(公告)日：2022-08-09
申请号：US17209954
申请日：2021-03-23
Applicant: Unimicron Technology Corporation
Inventor： Cheng-Jui Chang , Hung-Lin Chang
Abstract: A method for measuring a thickness of a dielectric layer in a circuit board is provided. The method for measuring the thickness of the dielectric layer includes the following steps. First, a circuit board including at least one dielectric layer and at least two circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes a test area including a test pattern and a through hole. The test pattern includes at least two metal layers. Next, a measuring device including a main body, at least one light source and a lens module is provided. When the main body is moved into the through hole, the light source emits light to the dielectric layer and the metal layer, and the lens module shoots the dielectric layer and the metal layer to form a captured image. The thickness of the dielectric layer is obtained via the captured image.
-
公开(公告)号：US11408720B2
公开(公告)日：2022-08-09
申请号：US17209738
申请日：2021-03-23
Applicant: Unimicron Technology Corporation
Inventor： Cheng-Jui Chang , Hung-Lin Chang , Jeng-Wey Chiang
Abstract: A method for measuring thickness of dielectric layer in circuit board includes the following steps: First, circuit board including dielectric layer and circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes test area including test pattern and through hole. The test pattern includes first conductor and second conductors. The distance between the side of the through hole and the second conductor is less than the distance between the side of the through hole and the first conductor. Next, measuring device including conductive pin and sensing element is provided. Next, the conductive pin is powered, and one end of the conductive pin is electrically connected to the second conductor. Next, the sensing element is moved along the through hole to obtain sensing curve, and the thickness of the dielectric layer is calculated via variations of the sensing curve.
-
-
-
-
-
-
Search Results
7
records
(took 0.011 seconds)
