公开(公告)号：US20210202418A1

公开(公告)日：2021-07-01

申请号：US16781937

申请日：2020-02-04

Applicant: United Microelectronics Corp.

Inventor： MING-TSE LIN ,  Chung-Hsing Kuo ,  Hui-Ling Chen

IPC: H01L23/00

Abstract: A package structure of a semiconductor device includes a first substrate, a second substrate, and a bonding layer. The bonding layer bonds the first substrate and the second substrate. The bonding layer includes an inner bonding pad pattern and an outer bonding pad pattern formed in a dielectric layer. The outer bonding pad pattern surrounds the inner bonding pad pattern. A first bonding pad density of the outer bonding pad pattern is greater than a second bonding pad density of the inner bonding pad pattern.