公开(公告)号：US20210202340A1

公开(公告)日：2021-07-01

申请号：US16780639

申请日：2020-02-03

Applicant: United Microelectronics Corp.

Inventor： YU-YUAN HUANG ,  Tsung-Kai Yu ,  Chen-Hsiao Wang ,  Kai-Kuang Ho ,  Kuang-Hui Tang

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/58

Abstract: A semiconductor device package structure includes a substrate. The substrate has a circuit structure formed in a die region. The die region is defined by a plurality of scribe lines configured on the substrate. A seal ring is disposed in the substrate and located at a periphery region of the die region, and surrounds at least a portion of the circuit structure. A trench ring is disposed in the substrate between the seal ring and the scribe lines. A packaging passivation cap layer covers over the circuit structure and the seal ring, and covers at least the trench ring.