公开(公告)号：US20200016702A1

公开(公告)日：2020-01-16

申请号：US16584233

申请日：2019-09-26

Applicant: United Technologies Corporation

Inventor： David A Raulerson ,  Kevin D. Smith ,  Zhong Ouyang ,  Lisa J. Brasche ,  William J. Brindley ,  David N. Potter

IPC: B23P6/00 ,  F01D25/12 ,  F01D9/02

Abstract: Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.