Method for linking two or more metals for photo and electronic materials
    1.
    发明授权
    Method for linking two or more metals for photo and electronic materials 有权
    用于连接两种或更多种用于照相和电子材料的金属的方法

    公开(公告)号:US08889879B2

    公开(公告)日:2014-11-18

    申请号:US13872544

    申请日:2013-04-29

    CPC classification number: C07F1/12 C07F9/5045

    Abstract: Embodiments of the invention are directed to bimetallic substituted triazole compounds and methods to prepare the compounds. The compounds include at least one 1,2,3-triazole that is substituted by two metal ions at the 1 and 4 or 5 positions of the triazole ring. An iClick reaction between a metal acetylide and a metal azide results in the bimetallic substituted triazole ring. Depending on the metal acetylide and the metal azide used, monomeric bimetallic substituted triazole compounds, oligomeric bimetallic triazole compounds, or polymeric bimetallic triazole compounds are formed. Polymeric bimetallic triazole compounds can be linear, branched, ladder, two-dimensional network, or three-dimensional networks.

    Abstract translation: 本发明的实施方案涉及双金属取代的三唑化合物和制备化合物的方法。 所述化合物包括在三唑环的1和4或5位被两个金属离子取代的至少一个1,2,3-三唑。 金属乙炔化物和金属叠氮化物之间的iClick反应导致双金属取代的三唑环。 根据金属乙炔化物和所用的金属叠氮化物,形成单体双金属取代的三唑化合物,低聚双金属三唑化合物或聚合双金属三唑化合物。 聚合双金属三唑化合物可以是直链,支链,梯子,二维网络或三维网络。

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