METAMATERIAL-BASED COMPACT ANTENNA-IN-PACKAGE SOLUTIONS IN FREQUENCY HANDOVER APPLICATIONS

    公开(公告)号:US20250015506A1

    公开(公告)日:2025-01-09

    申请号:US18747334

    申请日:2024-06-18

    Abstract: The present disclosure describes dual-band antenna arrays and related methods for manufacturing and implementing dual-band antenna arrays. One exemplary dual-band antenna array comprises a top layer of fused silica substrate; a bottom layer of fused silica substrate; a ground plane positioned between the top and bottom layers of fused silica substrate, wherein the ground plane comprises layers of three different metals; antenna patch elements arranged on top of the top layer of fused silica substrate; an input feedline arrange on the bottom layer of the fused silica substrate; and a meanderline complimentary split ring resonator structure etched on a top surface of the ground plane, wherein the input feedline is directly coupled to the meanderline complimentary split ring resonator structure and is configured to excite a plurality of resonance frequencies of the antenna patch elements.

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