公开(公告)号：US20250106996A1

公开(公告)日：2025-03-27

申请号：US18811795

申请日：2024-08-22

Applicant: VIA Technologies, Inc.

Inventor： Nai-Shung Chang ,  Ping-Hsun Hsieh ,  Hung-Sen Liang

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic assembly includes a circuit board having a mounting surface and outer pads located on the mounting surface and staggered. The outer pads include pairs of differential signal pads arranged adjacent to each other including a first pair of differential signal pads and a second pair of differential signal pads. The first pair of differential signal pads and the second pair of differential signal pads are symmetrically arranged with respect to a symmetry line. A center extension line passing through the first pair of differential signal pads and a center extension line passing through the second pair of differential signal pads intersect at an intersection point on the symmetry line. The center extension line passing through the first pair of differential signal pads or the center extension line passing through the second pair of differential signal pads and the symmetry line are not perpendicular to each other.