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公开(公告)号：US20220359974A1
公开(公告)日：2022-11-10
申请号：US17872095
申请日：2022-07-25
申请人： VEEA INC.
发明人： Michael MIRABELLA , Bob MIGLIORINO , Shaun GREANEY , Theodore LUBBE , Michael LICCONE , Dave DOYLE , Perry WINTNER , Clint SMITH
摘要： A resilient antenna securing device that includes a frame structure and a plurality of fin components projecting outwardly from the frame structure. The fin components are configured to receive and hold one or more RF antenna portions. Each fin of a first pair of the plurality of fins components includes a tab that extends toward the other fin of the first pair of fins. At least one first intermediate fin of the plurality of fins is disposed between the first pair of fins. The tabs from the first pair of fins together trap a first RF antenna portion between the tabs and the at least one first intermediate fin.
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公开(公告)号：US20220141324A1
公开(公告)日：2022-05-05
申请号：US17577642
申请日：2022-01-18
申请人： Veea Inc.
发明人： Dave DOYLE , Perry WINTNER , Michael LICCONE , Michael MIRABELLA , Bob MIGLIORINO , Shaun GREANEY , Theodore LUBBE , Clint SMITH
IPC分类号： H04M1/02
摘要： A modular wireless communications system (edge device, etc.) that includes a base unit having a base unit processor and one or more additional units that each include a processor, in which the base unit processor is configured with processor-executable software instructions to determine whether the base unit has been combined with the one or more additional units to create a combined unit and/or whether one or more of the additional units have been detached from the combined unit. The processor may automatically perform an edge reconfiguration interrogation and enumeration (ERIE) operation in response to determining that the base unit has been combined with the one or more additional units to create the combined unit or in response to determining that one or more of the additional units have been detached from the combined unit.
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公开(公告)号：US20210352802A1
公开(公告)日：2021-11-11
申请号：US17313073
申请日：2021-05-06
申请人： Veea Inc.
IPC分类号： H05K1/02
摘要： A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include a plurality of layers that include a plurality of signal layers, a plurality of ground plane layers, a plurality of inner signal layers, and a single core substrate layer. Each layer in the plurality of layers may be separated from every other layer in the plurality of layers by at least one prepreg substrate layer.
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公开(公告)号：US20230017840A1
公开(公告)日：2023-01-19
申请号：US17946450
申请日：2022-09-16
申请人： Veea Inc.
IPC分类号： H05K1/02
摘要： A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include signal layers, ground plane layers, inner signal layers, and a single core substrate layer. Each of the layers may be separated from the other layers by at least one prepreg substrate layer.
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