公开(公告)号：US09728306B2

公开(公告)日：2017-08-08

申请号：US14819210

申请日：2015-08-05

Applicant: Viking Tech Corporation

Inventor： Chi-Yu Lu ,  Chien-Ming Shao ,  Chien-Chung Yu ,  Guan-Min Zeng

IPC: H01C3/06 ,  H01C1/028 ,  H01C17/02

CPC classification number: H01C1/028 ,  H01C17/02

Abstract: A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.