公开(公告)号：US20210313247A1

公开(公告)日：2021-10-07

申请号：US17267539

申请日：2019-08-23

申请人： WASHINGTON UNIVERSITY

发明人： Damena AGONAFER ,  Binjian MA ,  Li SHAN ,  Patricia WEISENSEE ,  John Mark MEACHAM

IPC分类号： H01L23/427

摘要： A heat exchanger for thermal management of an electronic device includes a liquid delivery layer thermally coupled to the electronic device and configured to receive a liquid from a source. The heat exchanger also includes an evaporation layer comprising hollow pillars configured to receive a continuous flow of the liquid from the liquid delivery layer and evaporate the continuous flow of the liquid from droplets maintained on the hollow pillars. Each hollow pillar has an evaporation surface and a pore configured to channel the continuous flow of the liquid through the hollow pillar to the evaporation surface. The evaporation surface being configured to maintain a droplet on the respective hollow pillar within a contact line. The evaporation surface has a wetting efficiency of at least about 95% and the contact line has a length of less than about 0.0314 mm.