HEAT DISSIPATING MODULE
    1.
    发明申请
    HEAT DISSIPATING MODULE 有权
    散热模块

    公开(公告)号:US20130141869A1

    公开(公告)日:2013-06-06

    申请号:US13332577

    申请日:2011-12-21

    IPC分类号: H05K7/20

    摘要: A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.

    摘要翻译: 一种散热模块,包括:风扇; 和散热片; 导电元件,由导电材料制成,并且由第一导电部件和两个第二导电部件组成,其中第一导电部件设置成与加热元件接合,同时允许两个第二导电部件与热接合 散热片 和墙元素; 其中,来自所述加热元件的热​​量被传导到所述第一导电部件,在所述第一导电部件中,所述第二导电部件被进一步分成两个第二导电部件; 从风扇吹出的空气流被引导到加热元件,然后被壁元件阻挡,用于将空气流朝向散热翅片从进气侧转向出气侧,然后排出 的散热模块。