公开(公告)号：US12225689B2

公开(公告)日：2025-02-11

申请号：US17996446

申请日：2021-03-30

Applicant: WIELAND-WERKE AG

Inventor： Achim Gotterbarm ,  Manfred Knab ,  Jochen Dietl ,  Harald Gaibler

IPC: H05K7/20 ,  H05K5/06

Abstract: A cooling system for the liquid immersion cooling of electronic components. The system includes a container containing, in an interior, liquid heat transfer fluid into which electronic components are immersed, the container having a gas space above the surface of the liquid heat transfer fluid, and a heat exchanger device in the gas space of the container for forming liquid heat transfer fluid. The cooling system further includes a lock device on the container for exchanging electronic components, and the lock device has a lock space, which lock space is hermetically sealed with respect to the gas space of the container to prevent gas exchange.