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公开(公告)号:US20190355929A1
公开(公告)日:2019-11-21
申请号:US16133905
申请日:2018-09-18
Inventor: Bin Xu
Abstract: The present disclosure discloses an organic light emitting diode display panel, a manufacturing method thereof, and an organic light emitting diode display apparatus. The organic light emitting diode display panel may include a display region and a non-display region, and a surface of the non-display region filled with a sealant layer to smooth the surface of the non-display region. The non-display region of the display panel of the present disclosure may have a smooth surface. A peripheral wiring may be facilitated, and a process difficulty of the wiring may be reduced. Moreover, the sealant layer may absorb and disperse the stress between the layers, and may improve a de-lamination condition caused by an excessive stress.
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公开(公告)号:US11244994B2
公开(公告)日:2022-02-08
申请号:US16650873
申请日:2019-12-25
Abstract: A thin film transistor (TFT) array substrate and an organic light emitting diode (OLED) panel are provided. The TFT array substrate includes a display area and a non-display area. The non-display area is provided with a plurality of gate traces connected to a control chip, the TFT array substrate includes: a flexible substrate includes a metal jumper-joint sublayer disposed in the non-display area, wherein the metal jumper-joint sublayer is adjacent to the display area; and a thin film transistor is disposed on the flexible substrate, wherein the thin film transistor layer includes a plurality of thin film transistors correspondingly disposed in the display area, and a gate trace of each of the thin film transistors and the gate trace of the non-display area are connected by a jumper joint arrangement through the metal jumper-joint sublayer.
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公开(公告)号:US11424309B2
公开(公告)日:2022-08-23
申请号:US16301806
申请日:2018-09-27
Abstract: The A substrate includes a base substrate, a wiring layer, a flexible layer, and a gate driver on array circuit, which are sequentially stacked from bottom to top. One side of the wiring layer is provided with a through hole penetrating the flexible layer to expose the gate driver on array circuit, so that the gate driver on array circuit is electrically connected to the wiring layer with the through hole.
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公开(公告)号:US11411058B2
公开(公告)日:2022-08-09
申请号:US16471915
申请日:2019-02-20
IPC: H01L23/498 , H01L27/32 , H01L51/52 , H05K1/18 , H01L51/00
Abstract: A flexible display device includes a flexible display panel and a chip on film (COF) bonded to the flexible display panel; wherein the flexible display panel is divided into a display region, a bonding region on a side of the display region, and a bending region between the display region and the bonding region; wherein the COF comprises a main body portion and two expansion bonding portions respectively disposed at two ends of one side of the main body portion; wherein an edge of the main body portion adjacent to the two expansion bonding portions are disposed with a plurality of connection pins; wherein the COF is bonded to the bonding region of the flexible display panel through the plurality of connection pins.
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公开(公告)号:US11309359B2
公开(公告)日:2022-04-19
申请号:US16326486
申请日:2018-11-23
IPC: H01L27/32
Abstract: A display panel includes an array substrate and a display layer disposed on the array substrate. The display layer includes a plurality of display units. Each of the display units includes: a first electrode disposed on the array substrate; an organic material functional layer including a light-emitting area and a light-transparent area connected to and surrounding the light-emitting area, wherein the light-emitting area is disposed on the first electrode; a second electrode disposed on the organic material functional layer; a pixel defining layer disposed under a bottom surface of the organic material functional layer and extending from the light-emitting area to the light-transparent area, wherein there is a light-transparent void between the pixel defining layer and the array substrate; and a color resist filling the light-transparent void. Two adjacent color resists of any two adjacent display units have an overlapping region therebetween.
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公开(公告)号:US11163185B2
公开(公告)日:2021-11-02
申请号:US16462932
申请日:2019-02-19
IPC: G02F1/1333 , G02F1/1345 , G09F9/30 , H05K1/18
Abstract: A display device, including: a display panel, the display panel including a display region and a binding region disposed outside the display region; a flexible circuit board comprising a main body portion and a connecting portion disposed on one side of the main body portion, the connecting portion being disposed on the binding region; wherein, the connecting portion includes a first end, and at least one second end connected to the first end and extending in a direction from the first end to the display region.
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公开(公告)号:US20210351376A1
公开(公告)日:2021-11-11
申请号:US16320064
申请日:2018-09-05
Abstract: An organic light-emitting diode (OLED) display panel and a fabrication method thereof are provided. The OLED display panel includes an OLED substrate and a package portion. The OLED substrate includes an array substrate and an OLED layer disposed on the array substrate. The package portion includes: a first inorganic layer disposed on the OLED substrate and covering the OLED layer; an organic layer disposed on the first inorganic layer; a second inorganic layer disposed on a circumferential periphery of the first inorganic layer; and a third inorganic layer disposed on the organic layer and covering the organic layer and the second inorganic layer.
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