SYSTEMS AND METHODS FOR ALTERING HIGH THROUGHPUT CUTTING OF SEALING ELEMENTS ON PACKAGES

    公开(公告)号:US20200047365A1

    公开(公告)日:2020-02-13

    申请号:US16527766

    申请日:2019-07-31

    IPC分类号: B26D7/06 B65G13/04 B65B69/00

    摘要: Systems and methods described herein are optimized for cutting sealing elements on packages using optical radiation. Packages can pass through a cutting device that applies the optical radiation to damage, vaporize, or cut the sealing element (e.g., tape) on the package. The systems and methods control several aspects of the cutting process to adjust throughput, improve efficiency, and reduce line stoppages. Systems can include an in-feed conveyor that orients packages and rejects packages that are out of specification, which can lead to issues such as jamming or damage to the equipment. Systems can include a variable-speed cut conveyor controlled by a computing system to dynamically adjust the speed of packages based upon historical cut quality, environmental measurement data, and height data related to a vertical dimension of the package.

    SYSTEMS AND METHODS FOR HIGH THROUGHPUT CUTTING OF SEALING ELEMENTS ON PACKAGES

    公开(公告)号:US20230081340A1

    公开(公告)日:2023-03-16

    申请号:US17990871

    申请日:2022-11-21

    IPC分类号: B26D7/06 B65B69/00 B65G13/04

    摘要: Systems and methods described herein are optimized for cutting sealing elements on packages using optical radiation. Packages can pass through a cutting device that applies the optical radiation to damage, vaporize, or cut the sealing element (e.g., tape) on the package. The systems and methods control several aspects of the cutting process to adjust throughput, improve efficiency, and reduce line stoppages. Systems can include an in-feed conveyor that orients packages and rejects packages that are out of specification, which can lead to issues such as jamming or damage to the equipment. Systems can include a variable-speed cut conveyor controlled by a computing system to dynamically adjust the speed of packages based upon historical cut quality, environmental measurement data, and height data related to a vertical dimension of the package.

    SYSTEMS AND METHODS FOR HIGH THROUGHPUT CUTTING OF SEALING ELEMENTS ON PACKAGES

    公开(公告)号:US20200047364A1

    公开(公告)日:2020-02-13

    申请号:US16527735

    申请日:2019-07-31

    IPC分类号: B26D7/06 B65G13/04 B65B69/00

    摘要: Systems and methods described herein are optimized for cutting sealing elements on packages using optical radiation. Packages can pass through a cutting device that applies the optical radiation to damage, vaporize, or cut the sealing element (e.g., tape) on the package. The systems and methods control several aspects of the cutting process to adjust throughput, improve efficiency, and reduce line stoppages. Systems can include an in-feed conveyor that orients packages and rejects packages that are out of specification, which can lead to issues such as jamming or damage to the equipment. Systems can include a variable-speed cut conveyor controlled by a computing system to dynamically adjust the speed of packages based upon historical cut quality, environmental measurement data, and height data related to a vertical dimension of the package.