公开(公告)号：US07175330B1

公开(公告)日：2007-02-13

申请号：US11292009

申请日：2005-12-02

Applicant: Wei Hsuan Chen

Inventor： Wei Hsuan Chen

IPC: F21V33/00

CPC classification number: G02B6/0043 ,  G02B6/0036 ,  G02B6/0061 ,  G02B6/0068

Abstract: A backlight module is provided herein, which mainly contains a casing, a light mixing plate, a diffusion plate, a number of LEDs and optical sheets. The LEDs are positioned along the light incidence planes at the sides of the light mixing plate. The casing is positioned in front of the light mixing plate with the diffusion plate at the back opening of the light mixing plate. The optical sheets are placed in turn behind the diffusion plate. As such, the thickness of the backlight module is reduced significantly.

Abstract translation: 本发明提供一种背光模组，其主要包括壳体，光混合板，扩散板，多个LED和光学片。 LED沿着光混合板侧面的光入射面定位。 壳体位于光混合板的前面，扩散板位于光混合板的后开口处。 光学片依次放置在漫射板后面。 因此，背光模块的厚度显着降低。