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公开(公告)号:US11370589B2
公开(公告)日:2022-06-28
申请号:US15038593
申请日:2014-11-26
申请人: WestRock MWV, LLC
发明人: Francisco J. Garcia , Meng-Chuan Wu , Gregory P. Hayter , Matthew E. Zacherle , Mary Kathryn Suttle
IPC分类号: B65D73/00
摘要: A package is described for housing a product supported upon a blister portion of the package. The product may be an item whose weight may be supported by the blister. For some products such as cables, wires, or hoses the product may also be held in a desired shape.