公开(公告)号：US10806052B2

公开(公告)日：2020-10-13

申请号：US16351876

申请日：2019-03-13

Applicant: Wistron Corp.

Inventor： Chi-Wen Chu ,  Yun An Chang

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K5/00 ,  G02F1/1333

Abstract: The disclosure relates to a heat dissipation module, a display device having the same, and an assembly method thereof. Place the heat dissipation structure in between the chip of the COF (chip-on-film) and the thermal-conductive supporting component, heat generated by the chip of the COF can be absorbed by the heat dissipation structure and then be transferred to the thermal-conductive supporting component through the heat dissipation structure. As a result, the temperature of the chip is decreased, and the chip is avoided from operating at high temperature to deteriorate its performance and to result in thermal deformation or any other negative effects on the nearby components.

公开(公告)号：US20200154599A1

公开(公告)日：2020-05-14

申请号：US16351876

申请日：2019-03-13

Applicant: Wistron Corp.

Inventor： Chi-Wen Chu ,  Yun An Chang

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K5/00 ,  G02F1/1333

Abstract: The disclosure relates to a heat dissipation module, a display device having the same, and an assembly method thereof. Place the heat dissipation structure in between the chip of the COF (chip-on-film) and the thermal-conductive supporting component, heat generated by the chip of the COF can be absorbed by the heat dissipation structure and then be transferred to the thermal-conductive supporting component through the heat dissipation structure. As a result, the temperature of the chip is decreased, and the chip is avoided from operating at high temperature to deteriorate its performance and to result in thermal deformation or any other negative effects on the nearby components.