公开(公告)号：US20230163470A1

公开(公告)日：2023-05-25

申请号：US17811635

申请日：2022-07-11

申请人： Wistron NeWeb Corp.

发明人： Yuan-Chia HSU ,  Chin-Lung YEH

IPC分类号： H01Q9/04 ,  H01Q1/52 ,  H01Q5/40

CPC分类号： H01Q9/0414 ,  H01Q1/521 ,  H01Q5/40

摘要： A communication device includes a first ground element, a second ground element, a third ground element, a first signaling conductor, a second signaling conductor, a resonant circuit, and a dielectric substrate. The first signaling conductor is disposed between the first ground element and the second ground element. The second signaling conductor is disposed between the second ground element and the third ground element. The first signaling conductor is coupled through the resonant circuit to the first ground element. The dielectric substrate has a first surface and a second surface opposite to each other. The first ground element, the second ground element, the third ground element, the first signaling conductor, and the second signaling conductor are disposed on the first surface of the dielectric substrate. The resonant circuit is configured to increase the isolation between the first signaling conductor and the second signaling conductor in a target frequency band.