公开(公告)号：US20210392785A1

公开(公告)日：2021-12-16

申请号：US17323029

申请日：2021-05-18

Applicant: Wistron NeWeb Corp.

Inventor： Wei-Jie HUANG ,  Chun-Yu LEE

IPC: H05K7/20

Abstract: An electronic device with a heat-dissipation structure is provided. The electronic device includes a housing, a heat-dissipation member, and a restriction member. The housing includes a first sidewall and a second sidewall. The first sidewall includes a first sidewall connection portion. The second sidewall includes a second sidewall connection portion. The heat-dissipation member includes a heat-dissipation member connection portion that is detachably connected to the first sidewall connection portion. The first sidewall connection portion restricts the freedom of movement of the heat-dissipation member connection portion in a first direction. The restriction member is disposed on the heat-dissipation member. The restriction member is wedged into the second sidewall connection portion. The second sidewall connection portion restricts the freedom of movement of the restriction member in the first direction.

公开(公告)号：US20230178939A1

公开(公告)日：2023-06-08

申请号：US17815819

申请日：2022-07-28

Applicant: Wistron NeWeb Corp.

Inventor： Chih-Chun LIU ,  Wei-Jie HUANG ,  Jyun-Kai HUANG ,  Chun-Yu LEE

IPC: H01R13/6583 ,  H01R13/422

CPC classification number: H01R13/6583 ,  H01R13/4226

Abstract: A metal shielding frame is provided. The metal shielding frame is adapted to be disposed in a socket, wherein the socket is adapted to be electrically connected to a connector. The metal shielding frame includes a sleeve-shaped frame body and at least one ground hemming portion. The sleeve-shaped frame body includes a first enclosed edge.
The ground hemming portion is formed on the first enclosed edge. The socket includes a socket case and a socket joint. The socket case surrounds the socket joint. The sleeve-shaped frame body is adapted to be inserted between the socket case and the socket joint.