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公开(公告)号：US20240033773A1
公开(公告)日：2024-02-01
申请号：US17610713
申请日：2021-08-30
Inventor： Biwu LIU
CPC classification number: B05C11/1015 , B05C13/02 , B05C5/0275
Abstract: The present application provides a dispensing method for a display panel and a dispensing device for the display panel. The dispensing method for the display panel includes: scanning an outline of a position to be dispensed of the display panel to obtain a dispensing parameter of the display panel; determining whether the dispensing parameter satisfies a preset dispensing condition; dispensing glue on the display panel when the dispensing parameter satisfies the preset dispensing condition. The dispensing method for the display panel provided in the present application can monitor the display panel to be dispensed, so as to dispense glue on the display panel meeting the dispensing condition, thereby improving product yield of the display panel.
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公开(公告)号：US20230031523A1
公开(公告)日：2023-02-02
申请号：US17604597
申请日：2021-08-06
Inventor： Biwu LIU
Abstract: The present disclosure provides a glue-dispensing method of a display module and a glue-dispensing device of the display module. After the display module is fixed to a glue-dispensing platform, a region to be glue-dispensed of the display module is scanned in real time. And glue-dispensing terms are adjusted in real time according to scanning results, glue bodies formed by glue-dispensing are confirmed, and the glue-dispensing terms are deeply fine-tuned according to the glue bodies. Therefore, the embodiments of the present disclosure can achieve advanced prevention, process avoidance, a detection effect after completion, and a depth compensation according to the effect.
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公开(公告)号：US20240149579A1
公开(公告)日：2024-05-09
申请号：US18458836
申请日：2023-08-30
Inventor： Biwu LIU
CPC classification number: B32B37/1045 , B32B37/0046
Abstract: The embodiment of the present invention discloses a bonding device. The bonding device includes a main body and a lamination part connected to the main body. The lamination part is configured to press and bond an adhesive layer to an apparatus to be bonded, and includes a lamination main portion and a squeeze sub-portion connected to the lamination main portion. Along a lamination direction perpendicular to the lamination part, a width of the squeeze sub-portion is less than a width of the lamination main portion. The present invention, by using the squeeze sub-portion of the lamination part with a smaller width, more conveniently squeezes and bonds the adhesive layer, which facilitates mechanized bonding, improves a bonding efficiency, and reduces a labor cost while guaranteeing a bonding effect.
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