公开(公告)号：US20230326842A1

公开(公告)日：2023-10-12

申请号：US17718220

申请日：2022-04-11

Applicant: XILINX, INC.

Inventor： Li-Sheng WENG ,  Chun-Yuan CHENG ,  Chao-Chin LEE

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L24/08

Abstract: A chip package and method for fabricating the same are provided that includes a power delivery network (PDN) with non-uniform electrical conductance. The electrical conductance through each current path of the PDN may be selected to balance the distribution of current flow across the current paths through the chip package, thus compensating for areas of high and low current draw found in conventional designs.