公开(公告)号：US20230199941A1

公开(公告)日：2023-06-22

申请号：US17557877

申请日：2021-12-21

Applicant: XILINX, INC.

Inventor： Shad SHEPSTON ,  Robert Andrew DANIELS

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0228 ,  H05K1/114 ,  H05K1/0219 ,  H05K1/181

Abstract: Apparatus having at least one breakout structure are provided. In one example, an apparatus includes a dielectric layer, first and second contact pads, and first and second vias. The first and second contact pads are disposed on the dielectric layer. The first via is disposed through the dielectric layer and coupled to the first contact pad. The first via is offset from the first contact pad in a first direction. The second contact pad is immediately adjacent the first via. The second via is disposed through the dielectric layer immediately adjacent the first contact pad and coupled to the second contact pad. The second via is offset from the second contact pad in a second direction that is opposite of the first direction. The first and the second contact pads define a first differential pair of contact pads that is configured to transmit a first differential pair of signals.

公开(公告)号：US20240119208A1

公开(公告)日：2024-04-11

申请号：US17958249

申请日：2022-09-30

Applicant: XILINX, INC.

Inventor： Shad SHEPSTON

IPC: G06F30/367

CPC classification number: G06F30/367 ,  G06F2119/06

Abstract: A circuit analysis system performs a method for analyzing a power distribution network by determining a first S-parameter model for a first circuit element of the power distribution network. The first circuit element includes first ports that are coupled to first decoupling capacitors. Each of the first decoupling capacitors is associated with a respective first decoupling capacitor S-parameter model. The first S-parameter model is combined with one or more of the first decoupling capacitor S-parameter models to generate a combined S-parameter model for the power distribution network. Further, an impedance profile for the power distribution network is determined based on the combined S-parameter model.